Beam manipulation devices meant for ultrafast applications. Some products for ultrafast product line were designed to have thin dielectric thickness to minimize dispersion and make them suitable for use with sub 50 fs pulses.
When you have
>100W @ 1030/1070 nm
>30W @ 515/532 nm
>10W @ 343/355 nm
Designed for higher power applications like:
-
Laser lift-off
-
PCB drilling
-
Glass cutting
When you have
>100W @ 1030/1070 nm
>30W @ 515/532 nm
>10W @ 343/355 nm
Designed for high power applications like:
-
Microfabrication
-
PCB drilling
-
Scribing
When you have
>100W @ 1030/1070 nm
>30W @ 515/532 nm
>10W @ 343/355 nm
Designed for higher power applications like:
-
Laser lift-off
-
PCB drilling
-
Glass cutting
When you have
>100W @ 1030/1070 nm
>30W @ 515/532 nm
>10W @ 343/355 nm
Designed for high power applications like:
-
Micro machining
-
PCB drilling
-
Glass cutting
When you have
>100W @ 1030/1070 nm
>30W @ 515/532 nm
>10W @ 343/355 nm
Designed for high power applications like:
-
3D printing
-
PCB drilling
-
Glass cutting
When you have
<100W @ 1030/1070 nm
<30W @ 515/532 nm
<10W @ 343/355 nm
Designed for :
-
Glass drilling
-
Glass cutting
-
Writting Bragg gratings